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The Impact Inventor - Hardware Startup Incubation Program


Calling for social inventors for a chance to receive HKD 100,000 seed funding and one year of incubation support!

 What is the impact inventor program?

Designed to support social inventors, the Impact Inventor program equips its participants with the skills, knowledge and community essential to a successful startup.

Each week, the impact inventors will take part in a one-day bootcamp where they meet and learn from the leaders in the field. From understanding the problems at hand, developing value proposition, impact measurement, to building a viable business model, we will guide you through a social entrepreneurship journey.

We are looking for inventors who:

  • Want to make a difference in our society and the environment
  • Have a prototype of product ready for testing or can contribute professional knowledge to fellow inventors (expertise in a particular field required)
  • Can commit to 5 weekly bootcamps and a pitching event from September – November, 2017
  • You and your team members should be aged between 18 and 30 

 Why should you participate?

  • Gain exclusive access to a group of mentors made of international leaders in the areas of social invention and impact investment
  • Receive free training and opportunities to put your product(s) to test
  • Get a chance to win HKD 100,000 seed funding and one year of incubation support
  • Meet fellow social inventors and be part of a growing community

 Important Dates

Please mark your calendar and be sure that you are able to participate in the bootcamps and pitching day

Bootcamp Dates:

Session 1: September 30, 2017 (Saturday)
Session 2: October 7, 2017 (Saturday)
Session 3: October 14, 2017 (Saturday)
Session 4: October 21, 2017 (Saturday)
Session 5: October 28, 2017 (Saturday)

Pitching Day: November 11, 2017 (Saturday)

 How do I apply?

You may apply as an individual or as a team. Application can be found HERE and deadline for application is 31 August, 2017.

For more details, please email:


Program Sponsor: